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dc.contributor.author
dc.date.accessioned2016-02-20T06:27:55Z
dc.date.available2016-02-20T06:27:55Z
dc.date.issued02/20/2003
dc.identifier.isbn978-2-83-186843-1;2-83-186843-2
dc.identifier.issn
dc.identifier.urihttp://ir.nmu.org.ua/handle/GenofondUA/23423
dc.description.abstractSpecifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates. Defines requirements and guidelines for good workmanship and practice in the preparation, soldering, inspection and testing of electronic and electrical assemblies. Enables achievement of high yields and high product quality through process control in production.
dc.language.iso
dc.publisher
dc.subject
dc.subject
dc.subject.ddc
dc.subject.lcc
dc.titleIEC 61192-1 Ed. 1.0 b:2003 = Workmanship requirements for soldered electronic assemblies - Part 1: General
dc.typeother
dc.identifier.aichLMVIZXAKFHAEFQVQ2LFJCMBU5IZ5KV2T
dc.identifier.crc3245BF940D
dc.identifier.doi
dc.identifier.edonkey96CA3E56789EF83C552FB56FF6E3C417
dc.identifier.googlebookid9782831868431
dc.identifier.openlibraryid
dc.identifier.udk
dc.identifier.bbk
dc.identifier.libgenid1147613
dc.identifier.md5cb2a95d725cc6882e02ea683022b1805
dc.identifier.sha1G5QAT2U4KZJ6KAMMUF5Q3Y2GARKMJQ6Y
dc.identifier.tthYKIU7QHYMV3OWEJPN2HGZ7LVN4FW3KKMRH32KFI


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